ACS-300 Advanced Control System
First in-line, non-contact metal films advanced metrology system to
provide independent measurements of single stack of conductive film
thickness, sheet resistance, bulk resistivity and uniformity on
product wafers
The Challange: With the
transition to the 90-nm node, yield issues are constantly emerging.
Chipmakers are facing an entirely new set of complex process
integration challenges that cannot be addressed with existing metrology techniques.
Even medium complexity IC requires matching of over 80 process chambers.
Constant monitoring of film thickness and uniformity in production
is necessary to alert chipmakers to variations that can result in significant
yield and reliability hazards.
The Solution:
Most metrology techniques utilized by manufacturers today are either
partially or fully destructive, or extremely elaborate in their
design and/or operation.
ACS-300 is non-contact, non-destructive, and simple in operation.
It can distinguish individual conductive layers when measurements
performed sequentially.
Depending on end-user needs, ACS-300 can be configured to take
measurements in up to 127 spots simultaneously within a single second,
leaving production bottleneck a thing of the past.
ACS-300 modular architecture allows end-user to configure this
tool for specific applications that span front-end-of-line (FEOL) and
back-end-of-line (BEOL) metrology applications in a typical IC fab.
The Solution:
Primary applications for ACS-300 at the 90-nm node include film
thickness and uniformity on multi-layer film stacks, such as
copper barrier/seed, electrochemical plating (ECP) copper, and copper
chemical mechanical planarization (CMP) films, as well as ultra-thin
ALD barriers and other metal films.
Emerging applications at the 65-nm node include cobalt tungsten
phosphate (CoWP) cap layers, and ultra-thin multi-layer magnetic
random access memory (MRAM) stacks.
The module is suitable for measuring "sheet-p" and uniformity
of SiGe, strained Si and SOI wafers.
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Key Features
- Enables contact-less, fast and accurate measurement of conductive films of a wide range of film thickness from 30Â to 6µm
- Distinguish individual conductive layers when measured sequentially
- Inspects for coating uniformity
- Offers convenient GUI and 2D/3D data presentation
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ACS-300 Overview
ACS-300 Spec Sheet
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