Bump Adhesion/Electrical Connectivity Verification
MultiMetrixs intends to develop a new 200/300 mm Wafer
Bump Inspection Tool, the BIT-200/300xM.
The tool will test connectivity or integrity of a plurality of
bumps formed on a semiconductor wafer by directly measuring contact
conditions on the interface between the bump and the wafer or a
semiconductor die using RST method.
The tool will provide end-user with information of whether
problem with bump adhesion/electrical connectivity or quality of
adhesion/electrical connectivity on each individual bump exists.
It will also provide evaluation of the electrical integrity of the die. Please
review feasibility study published by
FlipChipDotCom.
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