MPS-200 Wafer Inspection System
Fast, accurate and reliable metrology tool for semiconductor
bulk materials and conductive films measurement, as well as
inspection of patterned and blanket wafers.
The Challange:
Decreasing IC fabrication cost while managing increasingly complex
chip designs via adaption of new non-contact and non-distractive
technologies, avoiding wafer contamination and ensuring a small spot size.
The Solution:
MultiMetrixs MPS-200, a revolutionary new Resonance Sensor Technology (RST)
Wafer Inspection System, incorporates state of the art sensor technology and
innovative stage design to deliver high-speed analysis of conductive and
semi-conductive films and substrates.
MPS-200 inspection system utilizes MultiMetrixs´ patented RST
sensor enabling measurements of film thickness ranging from 20Å to 6µm.
To simplify calibration, the MPS-200 wafer inspection system is equipped
with proprietary 4-point-probe sensor.
The programmable rotary (Θ) and linear (X) stage provides fast
scanning and mapping of film thickness and sheet resistance over a pre-determined
area of the substrate.
By interpreting up to hundred thousands points per scan, the MPS-300
proprietary data acquisition software enables high resolution 2-D and 3-D
mapping with scan time ranging from seconds to few minutes.
Wide Range of Applications
- Handles 100, 150, 200 and 300mm wafers
- Measures all relevant materials:
- Metals: Cu, Ta, Al, Au, W, Mo, Co, Ni, Ru, Pt, Cr, Ti, alloys
- Semiconductors: Si, GaAs, doped Si, doped GaAs, implanted semiconductors
- Contact and non-contact measurement of film parameters
- Multi-layer coating characterization
- Measurement of sheet resistance and film thickness
- Mapping properties of bulk materials and coated wafers
- Patterned wafer mapping
- Coating uniformity
- Defect inspections
- Wafer edge exclusive zone inspections
- Extendable for dielectric measurements
MPS-200 Overview and Spec Sheet
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