|
MultiMetrixs Resonance Sensor Technology
Applications
|
Key Features
- Enables contact-less, fast and accurate measurement of any film with thickness as low as 3nm
- Simplifies manufacturing process, as one RST tool can be used for a variety of metrology applications, including real time process monitoring
- Provides a cost-effective alternative for multi-layer structure analysis and deep sub-100-nm feature inspection and control
|
Wide Range of Applications
- Thickness measurement of thin conductive coatings on non-conductive and doped substrates
- Conductive layers on other conductive materials
- Thickness measurement of ultra thin non-conductive materials
- Measurement of dielectric permittivity
- Bumps quality adhesion inspection
- Wafer edge exclusion zone inspection
- In-situ film thickness measurement
- Concurrent, multi-point, user-defined measurement of thin films
- In-situ process control
- Measurement of dielectrics permittivity.
- Measurement of dielectric coating uniformity
- Remote temperature measurement and monitoring (ambient to 800°C)
|
Direct and Indirect Measurement Parameters
- Film resistivity
- Bulk resistivity
- Sheet resistance
- CV characteristics
- IV characteristics
- Wafer profile
- Dielectric constant
- Film thickness
- Topography
- Temperature
|
|
Major Benefits to IC Manufacturers
- Process equipment efficiency improvement
- Support maximum tool throughput
- Significant reduction of scrap and rework
- Possibility of real time measurement and process control of each wafer
- Easy support for new technologies
- Low cost of ownership
|
|
