MultiMetrixs Resonance Sensor Technology
Fast, accurate and reliable metrology method for dielectric,
semiconductive or conductive film measurement on patterned
and blanket wafers.
The Challenge:
Decreasing Wafer Fabrication Costs,
while Managing Increasingly Complex Chip Designs
The wafer production fabs of the 21st century demand metrology
tools that are cost effective, versatile, consistently accurate
and modular in design.
Only such tools can help decrease exploding wafer fabrication
costs while increasing yield through early defect
inspection and control.
Because of intrinsic limitations associated with X-ray,
Eddy Current, 4 point probe, ellipsometry,
reflectometry, and other optical methods,
there is a need for new technology that can address the challenges
associated with increasingly sophisticated chip designs aggressively
advancing into deep sub-100-nm feature sizes.
This technology must also minimize tool complexity, increase
throughput and reduce overall metrology cost of ownership (COO).
The Solution:
Innovative Contactless Method
Offering Multi-functional Measurement Capability
All MultiMetrixs precision measurement tools utilize a novel and proprietary
Resonance Sensor Technology (RST)
developed by MultiMetrixs. RST is based
on the analysis of electrical resonance characteristics for any type of layer
(dielectric, semiconductive or conductive, and patterned or blanket).
RST metrology capable to handle a
wide range of applications performing measurement and analysis of over
10 different parameters with superior speed, accuracy and repeatability,
thereby decreasing operational complexity and delivering lowest COO
and maximum ROI.
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Standard RST Sensor Specifications
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Measurement spot size
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0.25mm² - 40mm²
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Measurement range (resistance - Ohm/sq)
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0.001-250
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Accuracy (resistance)
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< 1%
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Repeatability (resistance)
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< 0.05%
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Range of film thickness
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1nm - 6,000nm
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Types of measurable film
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Cu, Al, W, Mo, Au, Co, Ni, Ru, Ti, TiN, Co, Cr
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Relative dielectric constant
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1 - 500
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