In-Situ Process Control Solutions:
CMP
In-situ film metrology is increasingly used for CMP process control to manage
and increase production yields.
Real time metrology enable process engineers
to monitor production process from start to finish.
Increase in production speed and shrinking geometries of IC
require tight monitoring during CMP process.
Ability to monitor removal rate to increase speed of operation
and correct uniformity related problems regardless film thickness and
other related issues has become one of the major challenges
for semiconductor industry.
This critical role of film metrology has led to the development
of production-worthy, fully-automated closed loop feed back system that
in real time control conductive films removal rate, thickness, uniformity
and end point detection.
Every CMP tool end-user relies on metrology instrument to find end point.
Most CMP toolmakers utilize optical methods or Eddy Current
technology for that purpose.
While Eddy-Current technology could be used for monitoring
film removal rate with high conductivity films its accuracy
significantly drops when it comes to measuring films under 100 nm.
Optical devices cannot monitor removal rate of non-transparent films at all.
While Eddy Current method has limitation as to very thin and low
conductivity films, optical methods are very sensitive to
any changes in CMP process, different polishing pads,
change in slurry or polished materials.
RST technology is ideal to overcome all challenges described above.
RST sensor can be integrated in either platen or carrier depending
on customer preference.
With speed of measurement of 30,000+ per second and ability to
accurately measure continues conductive films below 50 Angstrom
from both sides of the substrate, make RST system significantly
superior to any other method on market today.
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