In-Line Process Control Solutions:
Multi-Layer Conductive Films Inspection
Problem:
There is no tool on the market today that can reliably map thickness and
uniformity of a conductive film on top of other conductive film.
Solution:
MultiMetrixs´ MPS-150/200/300, MS-FIS 200/300, and ACS-200/300 tools
can perform that task.
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Two step measurement of cap layer (CoWP) 50Å above 1,000Å Cu film
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2D Scan of Cu film before cap layer
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3D Scan of Cu film before cap layer
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2D Scan after deposition of
the cap layer
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3D Scan after deposition of
the cap layer
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2D (Cu + cap layer) - Cu layer
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3D (Cu + cap layer) - Cu layer
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Bottom pictures were obtained by subtraction of "Cu layer"
from "Cu + cap layers".
The result clearly shows that the deposited cap layer is not uniform
and that the deposition process needs adjustment.
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