In-Line Process Control Solutions:
Wafer Edge Defects Inspection
Problem:
Existing metrological methods (spectroscopic elepsometry or reflectometry,
scatterometry, optical profilometry) are poorly suitable for defects or
exclusion zone inspections.
The difficulties are due to the light beams reflecting off beveled
wafer edges making inspection and measurements virtually impossible.
Solution:
RST-based Edge Defects inspection tools do not use reflecting light beams,
therefore by-passing the physical limitations of the exiting methodologies.
The RST-based tools offer substantial yield improvements by positively
detecting wafer edge defects without impeding the manufacturing process.
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The following picture represents the data obtained from a
wafer scan performed using MPS-150
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Defining CVD (metal) deposition boundary relative to wafer edge
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