MultiMetrixs´ novel RST Wafer Inspection Solutions
incorporate state-of-the-art sensor technology to deliver accurate,
high-speed analysis of conductive thin and thick film coatings on
semiconductor wafers and other substrates. Each metrology tool is
utilizing MultiMetrixs´ patented Resonance Sensor Technology (RST)
sensors and a programmable rotary (Θ) and/or linear (X, Y) stage that
provide fast scanning and mapping of film thickness, sheet resistance,
uniformity, stress, etc. over a predetermined area of the substrate.
Most tools are also equipped with a MultiMetrixs proprietary
4-point-probe that simplifies independent, in-line calibration and
provides the capability to analyze multi-layer structures.
MultiMetrixs´ proprietary data acquisition software can
represent 2 and 3 dimensional mapping of inspected parameters.
High mapping resolution with up to 1.5 million points measurements
per scan is available per customer specification.
Film scan time depends on the resolution required and ranges
from seconds to minutes.
The array of sensors can cover a wide range of film thicknesses; e.g.
Cu layer film thicknesses from 20Â to more than 30,000Â.
- Film thickness, resistivity and uniformity
- Single or a stack of conductive films measurement
- Measurement and monitoring of invisible layers
- Patterned wafers defect inspections
- Wafer edge defect inspection
- Wafer edge exclusion zone inspection
- Pattern wafer resistivity measurement
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