In-Line Process Control Solutions:
Measuring and Monitoring Optically Invisible Layers
Problem:
There are no inspection tools on market today that can reliably map
conductive film residue after CMP process and there are no tools that
can see submersed conductive films and artifacts.
Solution:
MultiMetrixs´ MPS and ACS family of tools can do both.
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Results of post-CMP wafer scanning.
Residual Cu can be clearly seen in areas around the wafer edge.
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Submersed layer with a clearly defined pattern is also visible.
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Metal nucleus on dielectric
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Under layer defects are clearly visible
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