MS-WIS 200/300
Multi-Sensor Wafer Inspection Module
MultiMetrixs´s MS-WIS 200/300 is a fast, accurate and
reliable metrology module designed specifically for instantaneous measurement
of wafer thickness and total thickness variation (TTV).
This state of the art metrology tool utilizes MultiMetrixs´s patented
new Resonance Sensor Technology (RST).
The innovatively designed measurement chamber is equipped with a built-in
49-points sensor to deliver full wafer characterization, including
optional bow and wrap, in 5 seconds per wafer.
MS-WIS 200/300 could be configured as an in-line stand alone tool,
integrated with sorter or any production tool.
Hardware Configuration
Measurement chamber with embedded sensors: 49 points for 200 mm and 300 mm wafers.
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MS-WIS 200/300 Specifications for Bare Wafers
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Thickness Range
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500 µm to 850 µm
90 µm to 500 µm optional
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Accuracy
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± 0.5 µm
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Total thickness
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± 0.25 µm
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TTV
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Repeatability
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0.5% or better
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Mapping
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Instantaneous with 2D and 3D data presentation
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Measurement Time
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0.25 sec per 49 points
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Optional Warp Measurement (w/o gravity correction)
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Max Warp
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800 µm
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Accuracy
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± 0.2 µm or 1% of reading
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Repeatability
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± 0.1 µm or 1% of reading
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Optional Resistivity in 49 points (requires an additional chuck)
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Low
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0.001 Ω-cm to 0.5 Ω-cm
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Mid
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0.5 Ω-cm to 100 Ω-cm
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High
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100 Ω-cm to 1,000 Ω-cm
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Component Reliability
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Uptime
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> 80%
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MTBF
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> 20,000 hours
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MTBA
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> 8,000 hours
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HW Features
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Pentium 4, 2 GB RAM, 120 GB HD, RS 232, special hardware, 4U rack mount
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Power
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Line Voltage: 110/220 V at 50/ 60Hz
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MIS-WIS 200/300 Fact Sheet
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