MultiMetrixs Contactless End-Effector
The Contactless Intelligent Edge Grip (CIEG) device was developed to assist in
handling all kinds of wafers, including thin-wafers with no contact from either
side of the wafer. It uses minimal airflow exhaust with disturbance no greater that robot´s motion.
By integrating our patented soft-touch mechanism with end-effector, CIEG overcomes
any potential problems associated with thin wafer handling such as sideward
shifting or rotation. Optical wafer presence sensor, integrated within the
end-effector, informs robot when to turn air on. The soft touch mechanism
confirms when the grip is successful and conforms to wafer´s
actual diameter. The wafer's exact diameter and center could be used for the
precision wafer placement. CIEG operates reliably with any robot at speed
equivalent to vacuum or edge-grip end-effectors and allows
for handling wafers in any plane and flipping operations.
Features
- The total thickness of the end-effectors´ blade is 3.5 mm, allowing the use of standard cassettes with .25" pitch
- The floating distance between end-effector and wafer is ~100µm
- 150mm wafer thickness > 30µm
- 200mm wafer thickness > 60µm
- 300mm wafer thickness > 100µm
- ISO Class II when Nitrogen is used
- Pick/grip times of 1.2 sec/wafer
- Release times of .5 sec/wafer
Applications
- Loading and unloading of thin wafers in FOUP or cassettes
- Thin-wafer placement and pick ups on any chuck or aligner station
- Single wafer transfer between process stations
- Solar cell and other thin substrate handling
- Reticles handling
Requirements
- Power: 12V, or 24V, 350 mW
- Communication:RS-232, RS-485 or CAN
- Compressed air: 60PSI
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