MultiMetrixs Edge Grippers:
for 300mm Wafers
Intelligent Wafer Gripping System
- Flexible confuguration
- Simple integration with any robot
- Sommunications via:
- RS-232, RS-485, CAN, and others
- Easy to teach
- High speed
- Cleanliness - ISO Class 1
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Basic Gripper IEG-300 and IEG-300D
- Self-centering to prevent wafer shift
- Safe-locking to secure wafers during EMO
- Soft touch to prevent particle creation
- Programmable grip force: 2 to 12N
- Electrically actuated
- Fast gripping: < 0.3 sec
- Light weight: 490 grams
Model IEG-300D is a dual-gripper configuration
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Gripper with Side Thrubeam IEG-300T
- Integrated Laser Class 1 Driver
- Capable to map compressed pitch: < 5 mm
- Power: 24V at 250mW
- Communications via RS-232, RS-485, CAN, and others
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Self-Centering U-Shape Gripper IEG-300US
- Safe-locking
- Soft touch
- Programmable gripping force: 2 to 10N
- Electrically Actuated
- Fast gripping: < 0.3 sec
- Optional Class 1 Laser Thrubeam
- Light weight: 550 gram
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Basic U-Shape Gripper for 200/300mm IEG-300U
- Safe-locking
- Soft touch
- Programmable gripping force: 2 to 12N
- Electrically Actuated
- Modular design
- Capable to map with compressed pitch: < 8mm
- Fast gripping: < 0.3 sec
- Optional Class 1 Laser Thrubeam
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Basic U-Shape Modular Gripper IEG-300UH
- 6-axis High Speed Application
- Safe-locking
- Soft touch
- Electrically Actuated
- Easily replaceable blade
- Mechanism box weight: < 400 gram
- Optional Class 1 Laser Thrubeam
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U-Shape Self-centering Gripper IEG-300HH
- Top approach
- Hot wafers: < 250°C
- Optional Class 1 Laser Thrubeam for:
- mapping in cassette and process boat
- wafer elevation determination
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Top Approach with Thrubeam and Vacuum Pad Gripper IEG-300TV
- Uniquely designed for wafer metrological equipment
- Supports use of small OD calibration wafers: 50-200mm
- Simplifies wafer chuck by eliminating lifting pins
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U-Shape Gripper IEG-300UD
- Safe-locking
- Soft touch
- Carbon-fiber blade
- Programmable gripping force: 2 to 12N
- Electrically Actuated
- Modular design
- Capable to map with compressed pitch: < 8mm
- Fast gripping: < 0.3 sec
- Optional Class 1 Laser Thrubeam
- Optional Could be used for dual-wrist application
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Self-centering Gripper with Side Thrubeam IEG-300CT
- Integrated Laser Class 1 Driver
- Capable to map compressed pitch: < 5 mm
- Power: 24V at 250mW
- Communications via RS-232, RS-485, CAN, and others
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Self-centering Gripper IEG-300C
- Integrated Laser Class 1 Driver
- Capable to map compressed pitch: < 5 mm
- Power: 24V at 250mW
- Communications via RS-232, RS-485, CAN, and others
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