MultiMetrixs Edge Grippers:
Optional Features Overview
Self-centering
MultiMetrixs IEGs can be configured to include a self-centering mechanism,
which simultaneously moves the three gripping tips toward wafer center
for holding, or away from wafer center releasing.
This unique feature greatly reduces the numbers of particles generated
during picking and placing of wafers, as it prevents them from sliding in a
cassette or boat.
In addition, the self-centering mechanism dramatically improves wafer
placement accuracy, reduces wafer positioning time and allows for wafer
misalignment of up to 5 mm.
Top-approach
IEGs can be configured to lift wafers from the top, while holding the
wafer 0.5mm from its edge.
It allows simplification of wafer handling in some processes
(e.g. picking of hot wafer with increased sagging)
while elimitating the necessity of lifting pins on OEM equipment.
Thru-beam mapping
MultiMetrixs has developed laser Class 1 thru-beam sensors that are
easily integrated into its family of intelligent grippers.
U-shape and Spade-type IEGs can be equipped with thru-beam for
mapping in the FOUP or cassette.
The top-approach IEG can be equipped with thru-beam to define
wafer´s elevation for safe picking.
Rotating distal gripping tips
Rotating distal gripping tips can be incorporated into any 300 mm edge
gripper to allow random access into small pitch cassette, boat or any narrow gates.
Leveling posts and adapter plate
For simple mounting and horizontal leveling of grippers, MultiMetrixs
offers a variety of leveling posts and custom adapter plates tailored for
any specific application and host robot´s mounting bracket.
|
