MultiMetrixs Through Beam Sensors:
cost-effective wafer positioning control
These low cost precision thru-beam sensors are specially designed
for wafer mapping, aligning and positioning. They are designed to prevent
production line stoppages and expensive crashes by identifying ALL wafer
misplacements - stacked, cross-slotted and empty slots.
MultiMetrixs’ thru-beam sensors can control the position of the wafer at
different stages in the chip making process. They will handle the majority of
applications related to the wafer mapping and alignment and could be integrated
into any wafer handling tool such as FOUP opener, vacuum end-effector, electrical
edge gripper, etc.
LTB-01
Precision long range LED through beam sensor
Accurately detects any kind of wafer in a cassette or
on a pre-aligner table.
The sensing range is up to 1.5 meters (5 feet) and the
unit will detect wafer thicknesses from 200 to 1000 microns.
TB-150/200/300
Reliable laser through beam sensors
Class 1 laser based thru-beam sensors are designed to handle the majority
of applications related to wafer mapping, aligning and positioning.
They will prevent ALL wafer misplacements - stacked, cross-slotted and empty
slots.
TB-150/200/300 are highly reliable sensors that could be easily integrated
into any wafer-handling tool such as FOUP opener, vacuum end-effector, electrical
edge gripper, etc.
LTB-M
Long range LED combined wafer-mapping sensor
LTB-M can reliably detect any wafer (including cross-slots) in a
cassette, by moving a very tiny (6x6x3 mm) sensor installed on
the robot arm and a string of LED source lights installed from
the back side of the cassette.
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